Technical Programming Committee Announced

 

Polymeric nanocomposites and nanomanufacturing

  • Landon Grace (North Carolina State U, U.S.)
  • Ica Manas-Zloczower I (Case Western, U.S.)

Rheology of polymers

  • Joao Maia (Case Western, U.S.)
  • Patrick Anderson (TU Eindhoven, Eur)

Processing (injection molding, extrusion, blow molding, thermoforming)

  • Javier Vera-Sorroche (UMass Lowell, U.S.)
  • Carol Barry (UMass Lowell, U.S.)
  • John Vlachopoulos (McMaster, Canada)
  • M.Cengiz Altan (Oklahoma State, U.S.)

Polymers and sustainability

  • Ramani Narayan (Michigan State U, U.S.)
  • John Dorgan (Michigan State U, U.S.),

Blends, compounding and mixing

  • Anup Ghosh (Indian Institute of Technology Delhi, Asia)
  • Clemenz Holzer (Montanuniversitat Leoben, Eur)

Bio-medical polymers

  • Stephan Laske (Saubermacher AG, Austria)
  • Tatiya Trongsatitkul (Suranee, Thailand)

Smart and multi-functional polymers and surfaces

  • Tehila Nahum (SLIPS Techologies, U.S.)
  • Petra Uhlmann (IPF Dresden, Eur)

Colloidal materials and advanced coatings

  • Hanna Dodiuk / Sam Kenig (Shenkar, M.E.),

Elastomers and foams

  • Chul Park (U. Toronto, CA)
  • Sadhan Jana (U. Akron, U.S.)

Simulation and design

  • Tim Osswald (U. Wisconsin, U.S.)
  • Jose Covas (U. Minho, Eur)
  • David Kazmer (UMass Lowell, U.S.)

3D Printing

  • Chris Hansen (UMass Lowell, U.S.)
  • Natalie Rudolph (U Wisconsin, U.S.)

Polymers and substrates for flexible electronics

  • Joey Mead (UMass Lowell, U.S.)
  • Miko Cakmak (Purdue, U.S.)

Fibers and textiles

  • Ramaswamy Nagarajan (UMass Lowell, U.S.)

 

Scientific Symposia announced!

Polymeric Nanocomposites and Nanomanufacturing

Rheology of polymers

Processing (injection molding, extrusion, blow molding, thermoforming)

Polymers and Sustainability

Blends, compounding and mixing

Bio-medical polymers

Smart and multi-functional polymers and surfaces

Colloidal Materials and Advanced Coatings

Elastomers and Foams

Simulation and Design

3D Printing

Polymers and Substrates for Flexible Electronics

Fibers and Textiles